3U CompactPCI-Serial

Smart solutions for complex data and high resolution multi display

• Individual MXM GPU (carrier board with MXM module)
• Intel 9th/11th 8-core CPU, up to 32GB/64GB DDR4 memory, soldered & SO-DIMM extension
• Standalone MXM carrier to configure with Type A/ B /B+ modules
• Up to 4 display ports on MXM carrier, 2 * DP1.4a and 2 * HDMI2.0, 4k/8k resolution support

High end AI intelligent solutions

• MIC-332AO , AI Inference CPU board Based on NVIDIA® Jetson AGX Orin™
• 2* RJ45 or M12 X-code GbE, 2 x USB 3.2 Gen 2 (10 Gbit/s), 1 x HDMI ports on 4HP front I/O
• 1 x DB9, 1 x micro USB service ports on 8HP front I/O
• 1 x on-board PCIe 3.0 x2 2242 M.2 socket
• Rich I/O resources to backplane as 1 * PCIe3.0 x8, 1* PCIe3.0 x4 or 10GbE, 1* GbE user defined or support more standard I/O board extensions upon request

Build your own “Multi-node Hybrid System”

• Achieves management of complex and critical can tasks
• “Multi-computing units” architecture , to quickly build with MIC-330 series (Intel CPU) + MIC-332 (NV Jetson) + Switch board
• Bandwidth breakthrough by using GbE/10GbE as internal connection

Centralized data streaming circuit design elevates data consolidation and streaming

• Supports 9th/ 11th Gen Intel® Core™/ Xeon® Processors
• TPM 2.0, Super Cap, FeRAM.
• Supports up to 32 GB DDR4, and SATA III / PCIe SSD interfaces.
• Supports  SATA III / PCIe SSD interfaces.
• Designed to meet EN50121-4 and EN50155 railway standards.
• PICMG CPCI-S (CPCI-S.0 R2.0) compliant.

Multiple system extensions in one device

• Accommodates single or multiple standard backplanes.
• Supports at least one CPU board, and up to 8 x I/O expansion slots on one single 9-slot backplane.
• Compliant with the PICMG CPCI-S.0 standard.
• The most cost-effective solution for vertical markets.

Supports hot-swapping and modular design

• Modular design increases expandability, consolidation, and flexibility.
• Fast system allocation and repair time.
• Has an MTTR of 30 minutes.

Innovative heat dissipation design

• Copper heat sinks and detachable fan modules direct heat out easily.
• Easily attach or remove fan modules for field applications.

Ideal for railways, smart manufacturing, and healthcare markets

• Deployment in railway transportation as pantograph monitoring, surveillance, and networking for better travel logistics.
• Deployment in the semiconductor industry for high-speed and precision control of high-yield fab production.
• Deployment in the healthcare industry to precisely control angles and positions for robotic surgical operations.

One-stop shopping: the CompactPCI® Serial total solution

The new CPCI-S is an on-rack-ready solution. It is comprised of standard 3U CPCI-S boards with 4 / 6 / 9-slot backplanes, and customized configurations. An additional two power slots are also offered. Moreover, it can run up to five computing units at the same time for different simultaneous functions depending on actual field scenarios